Resources Contact Us Home
Cooling structure for multi-chip module

Image Number 6 for United States Patent #6023413.

A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink, a cooling fan, and openings. In the multi-chip module, a plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.

  Recently Added Patents
Gaze tracking password input method and device utilizing the same
Vending machine
Lithographic apparatus and device manufacturing method
Solid state lighting circuit and controls
Enhancing user experiences using aggregated device usage data
Compounds, compositions and methods for reducing lipid levels
Wire catalyst for hydrogenation/dehydrogenation reaction and manufacturing method therefor
  Randomly Featured Patents
Multi-mode display device having an ambient light sensor and power-saving method of the same
X-ray tube frame support assembly
Method for mounting electronic components
Non-polluting open Brayton cycle automotive power unit
Inspection system and method
Angle of rotation detector
Wear protective liner assembly
System and methods for assembly of a web site for an online store by a seller
Stable bactericidal/permeability-increasing protein muteins
Method of and apparatus for pulse generator for electric discharge machining