Image Number 4 for United States Patent #6023413.
A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink, a cooling fan, and openings. In the multi-chip module, a plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.