Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Enhanced ceramic ball grid array using in-situ solder stretch with spring










Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.








 
 
  Recently Added Patents
Method for reserving network bandwidth for versioned network services
Generating network topology parameters and monitoring a communications network domain
Portable reading device with mode processing
High performance data transport system and method
Lead with lead stiffener for implantable electrical stimulation systems and methods of making and using
Uni-directional transient voltage suppressor (TVS)
Modular utility rack
  Randomly Featured Patents
Sample injector with plunger release for chemical analysis systems
IkB kinase, subunits thereof, and methods of using same
Apparatus and method for applying a dynamic pressure wave to an extremity
Laser scanning microscope
Modular rotatable warning light
Liquid crystal display device
Card display holder and protector
Process for producing organic carboxylic acid amides
Autoclaveable small-volume dropper bottle
System and method for distributed management of shared computers