Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Enhanced ceramic ball grid array using in-situ solder stretch with spring










Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.








 
 
  Recently Added Patents
Pet burial pod
Architecture, system and method for testing resistive type memory
Antisense modulation of C-reactive protein expression
Light-emitting diode package and method for manufacturing the same
Plasma doping method and plasma doping apparatus
Process for making diethyl ether from acetic acid
Systems and methods for documenting medical findings of a physical examination
  Randomly Featured Patents
Transdermal delivery system for administration of nitroglycerin
Side element of a shoe upper
Elastic coupling device for connecting two rotating parts
Managing organizational resources
Through casing resistivity measurement in permanently installed downhole production environment
Panel for display device with light blocking on blue color filter and liquid crystal display
Fuel saving variable closed position fuel and air flow control for vehicles with automatic transmission
Method of producing intraocular lens formed from polymide powder
Plug connector, jack connector and connector assembly
Waterproof glove for protective coveralls