Resources Contact Us Home
Enhanced ceramic ball grid array using in-situ solder stretch with spring

Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

  Recently Added Patents
Vehicle detection apparatus and method using magnetic sensor
3D solid-state arrangement for solid state memory
Spark plug
Semiconductor integrated circuit
Process for preparing soybean curd using micronized solution of soybean curd
System and method for parallel video processing in multicore devices
Printing system, information processing apparatus, print job processing method, information processing method, program, and storage medium
  Randomly Featured Patents
Radar absorption material thickness testing device
Heat dissipating module
Aroma diffuser apparatus
Removable handrail mounting bracket assembly
Lavandula plant named `Bentley`
Fiber optic light source adapter
Electronic device having an AGC loop
Apparatus and a method of recording an image of an object
Air-controlled lumbar support device
Magnetic field sensors and methods for fabricating the magnetic field sensors