Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Enhanced ceramic ball grid array using in-situ solder stretch with spring










Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.








 
 
  Recently Added Patents
Solar cell with hyperpolarizable absorber
Compositions of quaternary ammonium compounds containing bioavailability enhancers
Bi-directional pattern dependent noise prediction
Humidity indicator and method for fabricating the same
Inhibitor of casein kinase 1delta and casein kinase 1E
Portion of a display panel with an ambiguous facial expression icon
(-)-epigallocatechin gallate derivatives for inhibiting proteasome
  Randomly Featured Patents
Blood collection device
Highlighting for photocopiers and facsimile machines
Combination wall anchor fastener and fixture
Enhanced shadow page table algorithms
Stiffener fixation assembly for a protective assembly that protects a flexible tube against wear due to friction
Chair
Combination of azelastine and mometasone for nasal administration
Plasma expanders and blood substitutes
Polyarylene sulfide coated wire
Portable, selectively-reversible enclosure