Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Enhanced ceramic ball grid array using in-situ solder stretch with spring










Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.








 
 
  Recently Added Patents
Real-time pricing of shipping vendors
Efficient file system metadata scanning using scoped snapshots
Display screen or portion thereof with graphical user interface
Secure mobile ad hoc network
Automated processing machine used for processing samples placed on slides and having an output device
Bi-level switching with power packs
Methods of forming activated carbons
  Randomly Featured Patents
Method and computer-readable medium for detecting flesh-tone pixels
Shutter-type crimper
Corner construction for buildings having stacked tongue-and-groove lumber or log construction or the like
Ceramic heater
Oriented film laminates of polyamides and ethylene vinyl alcohol copolymers
Abuse resistant cells containing fluid depolarizers
Infant bath tub
Corrosion coupon holder
Cable reeler
Heading shield