Resources Contact Us Home
Enhanced ceramic ball grid array using in-situ solder stretch with spring

Image Number 2 for United States Patent #5968670.

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

  Recently Added Patents
Systems and methods for parameter adaptation
Integrated circuit with electromagnetic intrachip communication and methods for use therewith
Bias voltage generating circuit and switching power supply thereof
Semiconductor device having a bonding pad and shield structure of different thickness
Method for inhibiting thermal run-away
Method and system and policy server for guaranteeing data not to be interrupted
Cytokine biomarkers as predictive biomarkers of clinical response for Glatiramer acetate
  Randomly Featured Patents
Process for the manufacture of a shaft bottom
Straight setting pattern for clay bricks
Ignition energy management with ion current feedback to correct spark plug fouling
Video display device simulation apparatus and method
Gas-insulated bus
Rotating notched transmission x-ray for multiple focal spots
Portable carrier
Process for producing aminomethylphosphonic acid
Method and system for reducing NO.sub.x and fuel emissions in a furnace
Method and device for recognition of a handwritten pattern