Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a hybrid integrated circuit










Image Number 7 for United States Patent #5897724.

A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as W on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Porous conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the porous conductive material layers. Thick film conductor layers are formed on the copper-plated layers to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.








 
 
  Recently Added Patents
Light emitting device and illumination apparatus
Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device
Charging device
Method and apparatus for annotating media streams
Fluororubber-metal laminate gasket material
Opiorphin peptide derivatives as potent inhibitors of enkephalin-degrading ectopeptidases
Virtual switching ports on high-bandwidth links
  Randomly Featured Patents
Semiconductor radiation source
Content-based multimedia retrieval system and method thereof
Outboard motor
Deck screw
Method of making a component part of a reclining device
Band guiding and forming assembly for banding apparatus
Chain saw
Passenger space ventilation system for motor vehicles
Power supply
Semiconductor device having an electronically insulating layer including a nitride layer