Resources Contact Us Home
Power-ground plane for a C4 flip-chip substrate

Image Number 2 for United States Patent #5886406.

A package for an integrated circuit that contains a plurality of small circular dielectric spaces which separate vias from a conductive plane of the package. The package has a first internal conductive plane, a second internal conductive plane and a plurality of bond pads located on a top surface of a substrate. The substrate has a plurality of vias that extend through the first conductive plane to couple the second conductive plane to the bond pads. The package has a plurality of concentric dielectric clearance spaces that separate the vias from the first conductive plane. The small concentric spaces optimize the area of the conductive plane to minimize the resistance and maximize the capacitance of the package.

  Recently Added Patents
Quantifying the risks of applications for mobile devices
Removable storage device and method for identifying drive letter of the removable storage device
Trimming circuit and semiconductor device
Cardiopulmonary resuscitation monitoring apparatus
Digital broadcast receiver and method for processing caption thereof
Light irradiation element, image forming structure, and image forming apparatus
Collaborative system for capture and reuse of software application knowledge and a method of realizing same
  Randomly Featured Patents
Novel antibiotic vermisporin, process for the production thereof and pharmaceutical composition comprising it as an active antibacterial agent
Biocidal fluid filters
Buried heterostructure laser diode
Linear motor, a linear compressor, a method of controlling a linear compressor, a cooling system, and a linear compressor controlling a system
Semiconductor device and method of manufacturing same
Filtration capsule
Cigarette ashbin
Conditional purchase offer management system
Digital camera and operating method thereof