Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Power-ground plane for a C4 flip-chip substrate










Image Number 2 for United States Patent #5886406.

A package for an integrated circuit that contains a plurality of small circular dielectric spaces which separate vias from a conductive plane of the package. The package has a first internal conductive plane, a second internal conductive plane and a plurality of bond pads located on a top surface of a substrate. The substrate has a plurality of vias that extend through the first conductive plane to couple the second conductive plane to the bond pads. The package has a plurality of concentric dielectric clearance spaces that separate the vias from the first conductive plane. The small concentric spaces optimize the area of the conductive plane to minimize the resistance and maximize the capacitance of the package.








 
 
  Recently Added Patents
Superconducting magnetizer
Multiple secure elements in mobile electronic device with near field communication capability
Biometric data display system and method
Filler containing composition and process for production and use thereof
Image processing apparatus, image processing method, and program
Spectrometer
System and method for evaluating equipment rack cooling performance
  Randomly Featured Patents
Antifungal compounds
Hydrophilic electrode for an alkaline electrochemical cell, and method of manufacture
Semiconductor device including normally-off type junction transistor and method of manufacturing the same
Systems and methods for charging solar cell layers
Tool for lubricating two-piece drive shafts
Configuration for a container
Distributed database system with authoritative node
Periodontal lavage delivery system
Hydrostatic, slow actuating subterranean well tool manipulation device and method
Method and apparatus for detecting interpolation line