Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Power-ground plane for a C4 flip-chip substrate










Image Number 2 for United States Patent #5886406.

A package for an integrated circuit that contains a plurality of small circular dielectric spaces which separate vias from a conductive plane of the package. The package has a first internal conductive plane, a second internal conductive plane and a plurality of bond pads located on a top surface of a substrate. The substrate has a plurality of vias that extend through the first conductive plane to couple the second conductive plane to the bond pads. The package has a plurality of concentric dielectric clearance spaces that separate the vias from the first conductive plane. The small concentric spaces optimize the area of the conductive plane to minimize the resistance and maximize the capacitance of the package.








 
 
  Recently Added Patents
Aromatic amine derivative, organic electroluminescent element employing the same, and process for producing aromatic amine derivative
Highly specialized application protocol for email and SMS and message notification handling and display
Error scanning in flash memory
Non-volatile memory and method having efficient on-chip block-copying with controlled error rate
Method and apparatus for networked modems
Method and device for determining a set of frequencies that can be used for transmitting information between radio transceivers of a network operating with frequency hopping
Quaternary chalcogenide wafers
  Randomly Featured Patents
Safety apparatus for extracting hypodermic needles from the respective syringe
Injecting a fluid into a borehole ahead of the bit
Uncorrelated michelson interferometer
Portion of arithmetic operation control machine for electronic computer
Sky-light structure having a flexible-tube shaft
Constructional element for decorative purposes and toys
Carved table leg
Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer
Embolic protection device
Printing machine with an imaging device