Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged semiconductor device having a flange at its side surface and its manufacturing method










Image Number 8 for United States Patent #5885852.

For manufacturing a packaged semiconductor device, a lead frame with an electrically insulating strip member and a semiconductor chip is placed in a molding unit having upper and lower dies. The upper and lower dies have recessed areas for determining a size of a cavity of the molding unit different from each other, the size of the cavity being measured in a direction perpendicular to a clamping motion direction of the dies. The lead frame is positioned so that a surface of each lead with the insulating strip member applied thereto is contacted with one of the upper and lower dies having a larger recessed area and a molding line of the molding unit intersects the insulating strip member. The molding unit is closed to clamp the lead frame to depress and thrust into spaces between adjacent leads that part of the strip member which is outside the molding line and to form the cavity of the molding unit. By injecting a molding material into the cavity, a molding package is provided encapsulating the semiconductor chip and a portion of each lead. The packaged semiconductor device has a flanged side surface with an insulating strip provided between a step of the flanged side surface and intermediate portions of the leads which are between first portions of the leads encapsulated in the molding package and second portions of the leads protruding from the flanged side surface.








 
 
  Recently Added Patents
Remote ignition system for a vehicle and method for securing a remote ignition function
Redundant power delivery
Vehicle hood
Memory management configuration
Regulating a supply voltage provided to a load circuit
Para-xylylene based microfilm elution devices
Closed cell culture system
  Randomly Featured Patents
Electronic still video camera having electro-developing recording medium
PXE booting a storage processor from a peer storage processor
Thermal printer and thermal printing method
Poly-tri-fluoro-ethoxypolyphosphazene coverings and films
Toner adhesion amount detecting apparatus for an image forming apparatus
Settling tank sludge collector
Punching bag apparatus and supporting means
Apparatus for the manufacture of a foam material ball with an embossed surface
Rice blast susceptibility gene Pi21, resistance gene pi21, and uses thereof
In-situ formed capping layer in MTJ devices