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Lead-free, high tin ternary solder alloy of tin, silver, and indium

Image Number 3 for United States Patent #5874043.

A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.

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