Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Knitting fabric take-down device of flat knitting machine










Image Number 15 for United States Patent #5870904.

Knitting fabric take-down devices, located in front and back of and facing each other across a knitting fabric passageway formed under a needle bed gap between at least a pair of front and back needle beds of a flat knitting machine, for taking down a knitting fabric. Each of the knitting fabric take-down device includes a front knitting fabric take-down mechanism for capturing only a front part of the knitting fabric in the knitting fabric passageway and taking it down; a back knitting fabric take-down mechanism for capturing only a back part of the knitting fabric and taking it down; and a take-down force adjusting mechanism for adjusting a take-down force of each of the knitting fabric take-down mechanism. The front and back knitting fabric take-down mechanism each comprises a plurality of take-down members which are arranged along a longitudinal direction of the needle beds and are each adapted to be sequentially or individually actuated to take down the knitting fabric in the knitting fabric take-down operation.








 
 
  Recently Added Patents
Systems and methods for simultaneously configuring multiple independent backups
Apparatus and sensor for adjusting vertical sensor-alignment
Front portion of a vehicle, toy, and/or replicas thereof
Hydroxylated amide skin moisturizer
Lithographic apparatus and device manufacturing method
Gearbox housing
Method for adapting a contact point of a clutch in a drivetrain of a motor vehicle
  Randomly Featured Patents
Winding device and method for winding web material
Food bowl or similar article
Karaoke apparatus sounding instrumental accompaniment and back chorus
Truckbed toolbox
Flexible post in a dental post and core system
Model airplane and kit therefor
Brake cooling fluid diverter for an off-highway machine
Noise suppressor for use with vacuum air cleaner
Underwear
Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management