Resources Contact Us Home
Memory module and an IC card

Image Number 5 for United States Patent #5838549.

In semiconductor modules having a plurality of semiconductor devices mounted on a multilayer printed circuit boards as the processing speed increases, a short circuit current flowing through CMOS devices in the semiconductor devices during operation can cause noise because of ground inductance or power supply inductance. This noise can result in erroneous operations. To solve this problem, the power supply layer or grand layer that is connected to either the power supply terminal Vcc or the ground terminal Gnd of each semiconductor memory, which is located farther from the connection terminals, is arranged closer to the semiconductor memories with this arrangement, the short circuit current flowing through the semiconductor memories is more strongly magnetically coupled with the power supply layer or ground layer arranged close to them. Thus, it is possible to reduce the effective inductance. This, in turn, reduces noise, making it possible to provide a semiconductor module with an increased processing speed.

  Recently Added Patents
Rotation angle detecting device
Mobile device mode control based on dual mapping of availability (presence) information
Composite high reflectivity layer
Digital display
Statistical information collection from one or more device(s) in storage communication with a computing platform
Dye sensitised solar cell
Information obtaining and notification, data message forwarding and handover method and access node
  Randomly Featured Patents
System and method to automatically stack and unstack Java local variables
Double-sided hybrid high density circuit board and method of making same
Method for amplifying nucleic acid sequence
Vectors with modified protease-dependent tropism
Dynamic optical switching ensemble
Method and apparatus for saturation detection and electronic shutter in a solid state image sensor
Scalable shader architecture
Lead-free cationic electrodeposition coating composition, and electrodeposition coating process
Lift truck body