Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Printed wiring substrate










Image Number 2 for United States Patent #5729439.

A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of the land on which at least one of the parts is soldered is made greater on the side where the pants oppose to each other and made gradually narrowed toward the opposite side. By varying the width of the soldering land in reflow soldering using a cream solder, the surface tension of the solder is exerted such that the two parts are drawn to each other and brought into intimate contact thereby enabling close contact soldering.








 
 
  Recently Added Patents
Erasing a non-volatile memory (NVM) system having error correction code (ECC)
Optical coherence tomography with multiple sample arms
Antenna module and wireless communication apparatus
Method and apparatus for optimizing transmission diversity
Triple-action pest control formulation and method
Method and system for processing dictated information
Electronic device
  Randomly Featured Patents
Pressure transducer
Pet door locking frame
Hay bale loader and hauler
Single channel duplex communication system
Methods and compositions for the treatment of gastrointestinal disorders
Diesel fuel engine injection system and method therefor
System for awarding the highest priority to a microprocessor releasing a system bus after aborting a locked cycle upon detecting a locked retry signal
Twin wire press
Hydraulic function disconnect means
Dynamic orthopedic knee brace assembly