Resources Contact Us Home
Printed wiring substrate

Image Number 2 for United States Patent #5729439.

A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of the land on which at least one of the parts is soldered is made greater on the side where the pants oppose to each other and made gradually narrowed toward the opposite side. By varying the width of the soldering land in reflow soldering using a cream solder, the surface tension of the solder is exerted such that the two parts are drawn to each other and brought into intimate contact thereby enabling close contact soldering.

  Recently Added Patents
Pharmaceutical composition comprising gabapentin or an analogue thereof and an .alpha.-aminoamide and its analgesic use
Switched capacitor amplifier
White light emitting lamp and white LED lighting apparatus including the same
Semiconductor device
Flash memory apparatus and method for generating read voltage thereof
Vehicle control apparatus
Information processing apparatus and storage medium for storing information processing program
  Randomly Featured Patents
Dryer vent box and method
Staged alkylation in microchannels
Real-time rasterization system for a column-oriented printing apparatus or the like
Illuminated window blind assembly
Synthesis of 5-deazariboflavine
Rear wheel steering device for motorcycles
Underwater tunnel
Non-synchronous shifting hydromechanical steering transmission
Inflatable article
Rectifying P-N junction having improved breakdown voltage characteristics and method for fabricating same