Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Printed wiring substrate










Image Number 2 for United States Patent #5729439.

A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of the land on which at least one of the parts is soldered is made greater on the side where the pants oppose to each other and made gradually narrowed toward the opposite side. By varying the width of the soldering land in reflow soldering using a cream solder, the surface tension of the solder is exerted such that the two parts are drawn to each other and brought into intimate contact thereby enabling close contact soldering.








 
 
  Recently Added Patents
Headphone
Power generating apparatus of renewable energy type and method of attaching and detaching blade
Masking method and apparatus
Interlock apparatus for vacuum circuit breaker
Web-based royalty system and user interface
Chair
Use of endogenous promoters in genetic engineering of Nannochloropsis gaditana
  Randomly Featured Patents
Pumped EGR system
Modulated saturable absorber controlled laser
Pendant frame with retained elements
Blade
Hydraulic buffer hinge
Preparation of azinomethyl-rifamycins
Image recording apparatus capable of forming image outputs in various formats
Circuit breaker
Method and apparatus for dissolving nickel in molten zinc
Microprocessor having built-in CRC section and method for performing CRC operations using the same