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Printed wiring substrate










Image Number 2 for United States Patent #5729439.

A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of the land on which at least one of the parts is soldered is made greater on the side where the pants oppose to each other and made gradually narrowed toward the opposite side. By varying the width of the soldering land in reflow soldering using a cream solder, the surface tension of the solder is exerted such that the two parts are drawn to each other and brought into intimate contact thereby enabling close contact soldering.








 
 
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