Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Printed wiring substrate










Image Number 2 for United States Patent #5729439.

A printed wiring substrate in which first and second parts are mounted in adjacent with each other on soldering lands formed on an insulative board and put to reflow soldering, wherein the width of the land on which at least one of the parts is soldered is made greater on the side where the pants oppose to each other and made gradually narrowed toward the opposite side. By varying the width of the soldering land in reflow soldering using a cream solder, the surface tension of the solder is exerted such that the two parts are drawn to each other and brought into intimate contact thereby enabling close contact soldering.








 
 
  Recently Added Patents
Variable month cross-platform photo calendar builder
Reception method and reception apparatus
Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
Printable and printed articles
Method, apparatus and article for detection of transponder tagged objects, for example during surgery
Eyeglass component
Power supply system for motor vehicle
  Randomly Featured Patents
Apparatus and method for non-invasively sensing pulse rate and blood flow anomalies
Subcutaneous cardiac stimulation system with patient activity sensing
System and method for suppressing the spread of fire and various contaminants
Print system for executing printing operations based on macros selectively designated on document set basis
Row decoded biasing of sense amplifier for improved one's margin
Hair composition containing a polycondensate comprising at least one polyurethane and/or polyurea unit and a polyol
Method and system for driving a capacitively coupled fluorescent lamp
Wall panel
Methods of use of antiviral compounds
High-temperature, gas-burning furnace