Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Thin film chip-type filter with an external electrode formed on an adhesion layer










Image Number 4 for United States Patent #5699025.

A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.








 
 
  Recently Added Patents
Digital X-ray detector arrangement and digital X-ray imaging method
Headphone
Computer system for routing package deliveries
Bread basket
Method and apparatus for accessing and downloading information from the internet
Proximity-based mobile message delivery
Wristwatch
  Randomly Featured Patents
Photoelectric transducer
Chrysanthemum plant--Yellow Daymark cultivar
Medical wastes disposal system
Recording and/or reproducing apparatus
Magnetic disk protection mechanism, computer system comprising protection mechanism, protection method for magnetic disk, and program for protection method
Drinking straw for packaging containers
Enhancing biological knowledge discovery using multiples support vector machines
Signal receiver which indicates the status of the device connected thereto
Biopsy support with sectionable resilient cellular material
Cosmetic box