Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Thin film chip-type filter with an external electrode formed on an adhesion layer










Image Number 3 for United States Patent #5699025.

A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.








 
 
  Recently Added Patents
Synthesizing VHDL multiple wait FSMS into RT level FSMS by preprocessing
Over the counter medicinal container with surface ornamentation
Method and system for prioritizing points of interest for display in a map using category score
Pre-colored methodology of multiple patterning
Method and system for streaming digital video content to a client in a digital video network
Methods and systems for distributing broadcast messages on various networks
Fuel-based injection control
  Randomly Featured Patents
Skin examination device
Image processing apparatus and method configured to calculate defocus amount of designated area
Parallel HTS transformer device
Semiconductor memory device having a shielding line
Fiber reactive sulfo aryl azo N-substituted pyridone-3-carboxamide dyestuffs
Compounds
Process for preparation of control for use in estrogen receptor tests
Magneto-spring structure
Method and apparatus for fluid separation
Frequency hopping data link approach to autonomous GPS denied relative navigation determination