Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultrasonic wire bonding apparatus and method










Image Number 8 for United States Patent #5667130.

An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.








 
 
  Recently Added Patents
Resonant conversion system with over-current protection processes
Optical splitter device
Apparatus for touch screen avionic device
MEMS autofocus actuator
Lamination sheet
Hydrothermal synthesis of nanocubes of sillenite type compounds for photovoltaic applications and solar energy conversion of carbon dioxide to fuels
Bandpass filter and radio communication module and radio communication device using the same
  Randomly Featured Patents
Reactor for processing a semiconductor wafer
Removal of halos from glass-ceramic articles decorated with a ceramic color
Conveyor system and vehicle skid
Fastener construction with internal support for spaced portions of structural member
Heat transfer tube having internal ridges, and method of making same
Dispersion strengthened single crystal alloys and method
Three dimensional video screen display effect
Recoil starter system
Analyzer
Manufacturing method for isothermal evaporation casting process