Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultrasonic wire bonding apparatus and method










Image Number 8 for United States Patent #5667130.

An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.








 
 
  Recently Added Patents
Apparatus for touch screen avionic device
Categorization of design rule errors
Playlist search device, playlist search method and program
Security patch update processor
Delay interferometer using magneto-optic effect of a variable faraday rotator
Organic light emitting diode device and fabrication method thereof
Control strategies for a multi-mode drive system
  Randomly Featured Patents
Increased effective aperture for receive arrays
Liquid crystal display substrate with patterned area at periphery region thereof
Method for transmitting channel quality report in a discontinuous transmission scheme, primary and secondary stations therefor
Use of aromatic petroleum oils as surfactant for polyurethane foams
Net lurkers
Method for confirming authenticity of sheet
Accumulating conveyor
Survivability system
Single crystal SiC composite material for producing a semiconductor device, and a method of producing the same
Speech analysis and synthesis system