Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultrasonic wire bonding apparatus and method










Image Number 8 for United States Patent #5667130.

An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.








 
 
  Recently Added Patents
State detection device, electronic apparatus, measurement system and program
Charging current control method and charging system
Configuration method and system of complex network and configuration and management module of server resources
Information processing apparatus, including updating of program and program information, and method of updating program of the information processing apparatus
Vapor phase decarbonylation process
Eye therapy system
High dynamic range pixel structure
  Randomly Featured Patents
Change direction planetary gearing for continuously variable transmission
Integrated Electrooptic modulator and process for the production thereof
Collision avoidance system for use in aircraft
High toughness steel material and method of producing steel pipes using same
Flat panel display light guide
Molded tombstone/monument
Method of setting destinations of electronic mail
Speaker
UV curable elastomer composition
IC sheet cutting press and IC sheet processing apparatus using the same