Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultrasonic wire bonding apparatus and method










Image Number 8 for United States Patent #5667130.

An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.








 
 
  Recently Added Patents
Stepped delay control of integrated switches
Systems for usage based rate limiting over a shared data link
Process for preparing soybean curd using micronized solution of soybean curd
Header rail for a shower screen or the like
High-speed comparator with asymmetric frequency response
Light-emitting element, light-emitting device, and electronic device
Holding structure for a touch panel
  Randomly Featured Patents
Use of cardiotonic drugs and inhibitors of nitric oxide synthesis to alleviate pathologic hypotension
Bed for pets
Analog-to-digital converter utilizing time reference for effecting conversion
Air-cleaning apparatus
Cross bar
Adaptive quantization in a pulse-amplitude modulated system
Locomotive controller lockout device
Mixtures of HALS compounds
Implantation device for soft tissue markers and other implants
Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit