Resources Contact Us Home
Method for forming twin well

Image Number 6 for United States Patent #5661067.

An improved twin well formation method for a semiconductor device capable of improving the latch-up characteristic in DRAM device which requires a high integration density and of improving a recess problem which occurs due to the capacitor, which includes the steps of a first step which forms an insulation film on a semiconductor substrate having a first region and a second region; a second step which forms a first temporary film on an insulation film of the first region; a third step which forms a first side wall spacer at the first temporary side wall; a fourth step which implants a first conductive ion to a substrate of a second region; a fifth step which forms a second temporary film on a substrate of the second region; a sixth step which removes the first temporary film; a seventh step which implants a second conductive ion to a substrate of the first region; and an eighth step which anneals and removes the second temporary film and the first insulation spacer.

  Recently Added Patents
Method and apparatus for editing a program on an optical disc
Buckle (tube)
Millimeter wave imaging method and system to detect concealed objects
Architecture and method for multi-aspect touchscreen scanning
Semiconductor device
Method and apparatus for displaying system status with a wide range of viewing angle
  Randomly Featured Patents
Circuit arrangement for influencing the frequency response of a digital audio signal
Apparatus and method for determining stack distance of running software for estimating cache miss rates based upon contents of a hash table
Method and apparatus for grading and measuring a surface having a curved profile
Wettable article
Microcapsules and emulsions containing low bloom gelatin and methods of making and using thereof
Integrated two device non-volatile memory
Pet costume
Hearing device for a protective helmet
Stator core module, stator core assembly and process for assembling a stator core assembly