Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 17 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Glove
Fuel cell system with mechanical check valve
Combination of the application of antibodies for immunostimulation together with glucocorticoids
Expression of dirigent gene EG261 and its orthologs and paralogs enhances pathogen resistance in plants
Metal foil laminate, substrate for mounting LED, and light source device
Nanocatalysts structure, process for the preparation and use thereof
Shot scent dispenser
  Randomly Featured Patents
Beverage container cooler
Process for preparing pitches
Welding wire feed system
Seat slide assembly
Compact image scanner capable of reading both a light-reflecting article and a light-transmitting article
Autofocus actuator
Embolic filter delivery system and method
Binoculars
Low leakage and data retention circuitry
Formation testing and sampling apparatus and methods