Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 16 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Zoom lens
Systems and methods for performing live chat functionality via a mobile device
Rotating sunlight/light beam for fractional/beneficial use
High damage threshold frequency conversion system
Field device configuration system
Hydrofluorocarbon refrigerant compositions for heat pump water heaters
Formwork release composition and use thereof
  Randomly Featured Patents
Quadrature correlation phase determining apparatus
Cantilever for pickup cartridge
Semiconductor memory device
Homogenous assay of duplex of triplex hybridization by means of multiple measurements under varied conditions
Spacer for removable heat exchanger tubes
Folding bill and receipt holder
Device for selecting design options in an integrated circuit
Cable TV end connector starter guide
High frequency immersion vibrator comprising a cooled electronic frequency converter
Flow controller for aerosol container