Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 14 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Portable communication terminal, communication method and control program
Optical angular position detection apparatus and method
Image forming apparatus detecting color patterns and generating interleaf images at predetermined position
Quantifying the risks of applications for mobile devices
System and method for updating firmware
Fuel-based injection control
Distortion compensation device, distortion compensation method, and radio transmitter
  Randomly Featured Patents
Pen needle sharps port
Method for splicing strip ends together
Apparatus for providing a decorative cover for a flower pot using a collar
Method of detecting pollution in water using sonication
Multifunction door knob assembly
Apparatus to clean refractory-lined conveyor troughs
Arthropodicidal phosphorus-containing heterocycles
Lock cylinder
Hand instrument
Apparatus and method for processing multi-layer packet