Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 13 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Organic light emitting diode light source device
Systems and methods for performing live chat functionality via a mobile device
Digital signal processing apparatus, liquid crystal display apparatus, digital signal processing method and computer program
Using storage cells to perform computation
Flashlight
Cross-linkable compositions
Adjustable voltage regulator with dynamic voltage compensation
  Randomly Featured Patents
Method for forming a locking enclosure
Baffle for luminaire
Dual clutch pack dual operating clutch and method for adjusting same
Blower-vacuum device
Pedicure or manicure equipment
Wear-resistant wall linings for shells of mills and like apparatuses
Curable compositions
Leveraging communications to identify social network friends
Thin film transistor device and method of manufacturing the same, and liquid crystal display device
Alkynyl-bridged poly(arylcyclobutene) resins