Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 12 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Uni-directional transient voltage suppressor (TVS)
Buck converter having reduced ripple under a light load
Anti-fake battery pack and identification system thereof
Toy track intersection component
Dual use photovoltaic system
Nonvolatile semiconductor storage device having conductive and insulative charge storage films
Method and system for detecting target objects
  Randomly Featured Patents
Industrial microbicidal/microbistatic composition and use thereof
Temperature control structure for integrated circuit
Stencils and gauging device for aesthetically pleasing eyebrow shaping
Process for production of di- and polyamines of the diphenylmethane series
Nutation damper
Vent cover
Refractory nozzle
UDP to TCP bridge
Message box facility for graphical user interface for computer system video display
Process for preparation of 3,5-bisalkylphenols