Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for manufacturing a polyimide multilayer wiring substrate










Image Number 10 for United States Patent #5628852.

A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.








 
 
  Recently Added Patents
Method and device for extracting vapors in an injection molding machine
Activated carbon cryogels and related methods
Business card assembly
System and method for optimizing teams
Hydrogen generation device and fuel cell system
Thin film switch and press key/keyboard using the same
LED string with a capability to maintain a current path and LED unit thereof
  Randomly Featured Patents
Method of making a polymeric food spoilage sensor
Process for producing liquid crystal display device and liquid crystal display device
Integrated retractable belt clip
Method of customizing a standardized IT policy
Toner, production method thereof, developer, toner container, process cartridge, image forming method, and image forming apparatus
Controlling processor-based systems using a digital camera
Microwave oven
Driving apparatus of electronic ink display device and method therefor
Aluminum chelates
Provisioning communication services in a communications management network