Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Photopolymerizable biodegradable hydrogels as tissue contacting materials and controlled-release carriers










Image Number 15 for United States Patent #5626863.

Hydrogels of polymerized and crosslinked macromers comprising hydrophilic oligomers having biodegradable monomeric or oligomeric extensions, which biodegradable extensions are terminated on free ends with end cap monomers or oligomers capable of polymerization and cross linking are described. The hydrophilic core itself may be degradable, thus combining the core and extension functions. Macromers are polymerized using free radical initiators under the influence of long wavelength ultraviolet light, visible light excitation or thermal energy. Biodegradation occurs at the linkages within the extension oligomers and results in fragments which are non-toxic and easily removed from the body. Preferred applications for the hydrogels include prevention of adhesion formation after surgical procedures, controlled release of drugs and other bioactive species, temporary protection or separation of tissue surfaces, adhering of sealing tissues together, and preventing the attachment of cells to tissue surfaces.








 
 
  Recently Added Patents
Soybean cultivar CL0911610
Semiconductor device including insulating layer of cubic system or tetragonal system
Distylium plant named `PIIDIST-II`
Memory cell and memory cell array using the same
Container
Debris tray
Screen
  Randomly Featured Patents
Apparatus for gapping a continuous slide fastener stringer
Stun baton
Fauna guard
Optical information recording medium, and information recording method and information reproducing method using the same
Control of A/L ratios in vacuum assist vapor recovery dispensers
Weather resistant thermoplastic resin composition
Coordinate input apparatus and control method and program thereof
Suture relay for surgery
System and method to assist in the braking of an aircraft on a landing runway
Pre-process before cutting a wafer and method of cutting a wafer