Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Radio frequency bus leveling system










Image Number 7 for United States Patent #5546050.

A bus leveling system for automatically monitoring and maintaining the amplitude of a radio frequency (RF) signal carded on a bus. A two-stage variable gain amplifier (64) is connected in series with the bus. Each stage of the variable gain amplifier is constructed with a PIN diode (84, 86) in a feedback path of the stage. The amplification of the variable gain amplifier is varied by the injection of current into the feedback path to adjust the resistance of the PIN diodes. A control circuit having an RE detector (78) is provided to monitor and adjust the gain generated by the variable gain amplifier. Preferably, the control circuit and the variable gain amplifier are incorporated into an Application Specific Integrated Circuit (ASIC) (62). The RF detector is constructed of two Gilbert multipliers (202, 204) to minimize errors caused by operating condition changes, including variations in power supply voltage, temperature, or process.








 
 
  Recently Added Patents
Carbonyl-ene functionalized polyolefins
Continuous geospatial tracking system and method
Method of controlling mechanical mechanisms of optical storage apparatus for peak power/current reduction, and related optical storage apparatus and machine-readable medium
High throughput thin film characterization and defect detection
Scalable packet processing systems and methods
System and method for managing a loyalty program via an association network infrastructure
Card reader device
  Randomly Featured Patents
Method and apparatus for forming and dispersing single and multiple phase coating material containing fluid diluent
Linear scale
Exposure apparatus and device manufacturing method
Directional multi-blade boring head
Method and apparatus for measuring birefringence
Turf having solidified plasticized sulfur backing
Fluorinated diazabicycloalkane derivatives
Thermocouple connector for joining thermocouple wires
Stacking three dimensional leadless multi-chip module and method for making the same
Ultrasound apparatus