Resources Contact Us Home
Apparatus for performing wafer level testing of integrated circuit dice

Image Number 12 for United States Patent #5504369.

A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

  Recently Added Patents
Signal processing apparatus, display apparatus having the same, and signal processing method
Data management tool
Steering wheel
Lifting apparatus
Apparatus, method and program for image receipt, processing, conversion, and delivery to and from a plurality of external apparatuses
Systems and methods for flow mirroring with network-scoped connection-oriented sink
Device and method for controlling brightness of organic light emitting diode display
  Randomly Featured Patents
Lifeline retrieval device
Cooling apparatus for electrical machinery
Monoclonal antibodies specific for a human mononculear phagocyte-specific antigen
Millimeter-wave/submillimeter-wave oscillator
Kitchen knife
Hydrogen-water isotopic exchange process
Apparatus and method for cooling semiconductor devices
Catalytic absorbent and a method for its preparation
Method for calculating a location of a remote Unit utilizing observed time difference (OTD) and real time difference (RTD) measurements.
Filterless digital frequency locked loop