Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Apparatus for performing wafer level testing of integrated circuit dice










Image Number 12 for United States Patent #5504369.

A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).








 
 
  Recently Added Patents
Microcapsules, their use and processes for their manufacture
Automatic actuator for breakers or switches
TC-83-derived alphavirus vectors, particles and methods
Method and system for video parameter analysis and transmission
Method of patterning color conversion layer and method of manufacturing organic EL display using the patterning method
Steplessly adjustable cymbal locating device
Registration and network access control
  Randomly Featured Patents
Apparatus for monitoring the period of separation of impulses
Diffractive optical position detector in an atomic force microscope having a moveable cantilever
Vehicle door lock device
Hard sided luggage with soft covered externally accessible pouch areas
Highly processable aromatic polyamide fibers, their production and use
Method for immobilizing enzyme
Microfluidic cartridge
Container profile with stacking feature
Apparatus for bending section-sheet, plate strip and the like
Puzzle with meshing gear sections