Resources Contact Us Home
Apparatus for performing wafer level testing of integrated circuit dice

Image Number 12 for United States Patent #5504369.

A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

  Recently Added Patents
Plants and seeds of hybrid corn variety CH424126
Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
Antenna tuning on an impedance trajectory
Storage device, data processing device, registration method, and recording medium
Therapeutic human anti-IL-1R1 monoclonal antibody
Method and system for providing magnetic junctions having improved characteristics
Listing recommendation using generation of a user-specific query in a network-based commerce system
  Randomly Featured Patents
High speed precision sharpening apparatus
Multisectional building element with connection seam and method to manufacture same
Apparatus for reduction of bias in amperometric sensors
Ultrasonic cleaning method and device
Floating cover electrode guide system for electric discharge machining
Optical module
Grinding and dispersing method and apparatus
Automatic nail fastening device
Lan resource manager
Adjustable clamp for bone fixation element