Resources Contact Us Home
Apparatus for performing wafer level testing of integrated circuit dice

Image Number 12 for United States Patent #5504369.

A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

  Recently Added Patents
Position-measuring device
Method for determining an object class of an object, from which light is emitted and/or reflected to a vehicle
Method and device for processing broadcast packets/multicast control messages
Tailoring the band gap of solar cells made of liquid silane by adding germanium
Capacitance sensing
Managing personal information on a network
White polyester film and surface light source therewith
  Randomly Featured Patents
Optical films for directing light towards active areas of displays
Cross current control for power converter system
Method of producing covered elastic yarn
Method for placing and mechanically connecting panels
Non-resistive load driver
Method for detecting frame synchronization and structure in DVB-S2 system
Component sequencing and taping machine
Methods and devices for forming nanostructure monolayers and devices including such monolayers
Combined registration and call continuation method and apparatus for a mobile communication system
Method and apparatus for calibrating radio frequency base stations using antenna arrays