Resources Contact Us Home
Thermo-compression assembly/disassembly system for electric circuit board in inert ambience

Image Number 8 for United States Patent #5441194.

A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.

  Recently Added Patents
Method for forming pattern
Intrinsic absorber layer for photovoltaic cells
Pharmaceutical powder compositions
Vacuum cleaner
Linked area parameter adjustment for spinal cord stimulation and associated systems and methods
Method of operating an electromechanical converter, a controller and a computer program product
Prompt gap varying optical filter, analytical instrument, optical device, and characteristic measurement method
  Randomly Featured Patents
Arrangement for joining the cable ends of a stator winding of electric motors by means of a connector
Pressure-sensitive transfer elements and method
Method for producing products with water clusters
Pulsed signal transition delay adjusting circuit
Headset with multi-button control for a mobile communication device
Railroad car uncoupling lever with antifriction slideway arrangement
Yarn inspection system
Optical alignment system
Optical disc player with focus pull-in function
N-acyl and O-acyl derivatives of N,N-bis(2,2-dimethyl-3-hydroxypropyl)amine, their preparation and use