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Thermo-compression assembly/disassembly system for electric circuit board in inert ambience

Image Number 5 for United States Patent #5441194.

A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.

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