Resources Contact Us Home
Burn-in technologies for unpackaged integrated circuits

Image Number 5 for United States Patent #5397997.

A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.

  Recently Added Patents
System and method for providing restrictions on the location of peer subnet manager (SM) instances in an infiniband (IB) network
Device with a floating head having a heater element
Electronic document reading devices
Hydrogen generation device and fuel cell system
Parameter decoding apparatus and parameter decoding method
Automated measurement of concentration and/or amount in a biological sample
Meter socket cabinet
  Randomly Featured Patents
Detection of leaks in heat exchangers
Trailer hitch aligner set
Planar flat plate scanning antenna
Methods and compositions for impairing multiplication of HIV-1
Semiconductor device and method of manufacturing the same
Cart for spools of wire
Housing for electronic devices, electronic device using the housing and method for making the housing
Power line communications system and method
Plant-damaging animal repellant fence