Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Burn-in technologies for unpackaged integrated circuits










Image Number 5 for United States Patent #5397997.

A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.








 
 
  Recently Added Patents
Method for improving the textural attributes of baked snack foods
Method and system for reading from or writing to multiple surfaces of a disk
Organic EL device
Magnetic disk control device, magnetic disk apparatus, magnetic disk control method and computer program
Memory access techniques utilizing a set-associative translation lookaside buffer
Knob
Optical modulation device and optical modulation method
  Randomly Featured Patents
Total body shaver with comb
Container
Video reproduction apparatus, digital camera, semiconductor integrated circuit, and method for video reproduction
High-voltage power supply for an image forming device
Expression systems utilizing bacteriophage T7 promoters, gene sequences, and T7 RNA polymerase
Certain tricyclic pyrido[3,2,1-ij]cinnoline-8-carboxylates, useful as antimicrobial agents
Interconnection network with dynamic sub-networks
Fusion welded liquefiable gas cylinder with overpressure protection heads and method for making the same
Catalytic reduction of nitrogen oxides
Method and apparatus for testing the presence of magnetic storage medium on a given side of a tape