Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Burn-in technologies for unpackaged integrated circuits










Image Number 5 for United States Patent #5397997.

A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.








 
 
  Recently Added Patents
Systems and methods for dissipating an electric charge while insulating a structure
Rain barrel
Semiconductor device
Method and apparatus for communications
Integrated process for the manufacture of fluorinated olefins
System and method for detecting malicious code executed by virtual machine
Diagnostic data interchange
  Randomly Featured Patents
Layered microelectronic contact and method for fabricating same
Method of manufacturing an adjustable valve for surgical applications
Method for producing an organic thin film transistor and an organic thin film transistor produced by the method
Apparatus for manufacturing an elongated flooring member
Planetary gear type generating system
Multiple use forceps for endoscopy
Process for enhancing white liquor penetration into wood chips by contacting the chips with a mixture of the white liquor and a polymethylalkyl siloxane
Voltage boosting circuit with load current sensing
Heat exchanger assemblies
Low pressure mercury discharge lamp circuit arrangement