Resources Contact Us Home
Burn-in technologies for unpackaged integrated circuits

Image Number 5 for United States Patent #5397997.

A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.

  Recently Added Patents
Debris tray
Flat panel display device and stereoscopic display device
System for thermally controlling displays
Package for product
Using sets of OTDR receive fibers with different lengths of marker events to verify optical fiber connectivity
Dynamic reconstruction of a calibration state of an absorption spectrometer
Pyroelectric detector, pyroelectric detection device, and electronic instrument
  Randomly Featured Patents
Tools for use in dressmaking
Method for designing optimal single pointer predictive keyboards and apparatus therefore
Filling connection for a gas bottle valve
Aircraft fuel pump
Fault-tolerant output circuits
Image forming apparatus mounted with replaceable unit, image forming system, and method of controlling image forming apparatus
Multi-color machine vision system
Gas discharge lamp system with automatic shutoff means
Automated videocassette dispensing terminal with reservation feature
Concurrent flow mixing methods and apparatuses for the preparation of gene therapy vectors and compositions prepared thereby