Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Burn-in technologies for unpackaged integrated circuits










Image Number 5 for United States Patent #5397997.

A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.








 
 
  Recently Added Patents
Using interrupted through-silicon-vias in integrated circuits adapted for stacking
Multiple CQI feedback for cellular networks
Pixel circuit
Method and system for establishing security connection between switch equipments
Faucet handle
Antibodies to Clostridium difficile toxins
Image forming apparatus and method
  Randomly Featured Patents
Dredging installation
Field effect transistor
Closed loop polar modulation system with open loop option at low power levels
Recording medium, playback apparatus, recording method, and playback method
Phase locked loop system having locking and tracking modes of operation
Fuel injector remanufacturing method and remanufactured fuel injector
Chromogenic 1-(3-methoxy-4-alkoxyphenyl)-2-(2'-quinolyl)ethylene compounds
Fastener for bag
Method for activating metal surfaces prior to zinc phosphation
Diagnostic and therapeutic aspects of receptor-mediated leukemogenesis