Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Solder reflow mounting board










Image Number 4 for United States Patent #5373113.

A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.








 
 
  Recently Added Patents
Systems and methods for excluding undesirable network transactions
Supporting multiple channels of a single interface
Carbon blacks having low PAH amounts and methods of making same
Sound producing apparatus for vehicle
Synergistic compositions for the treatment of topical viral infections
Quantitative sleep analysis system and method
Biaxially oriented hydrolysis-stable polyester film comprising epoxidized fatty acid derivatives and a chain extender, and process for production thereof and use thereof
  Randomly Featured Patents
Process for preparation of 9.alpha. -chloro-11.beta. formyloxypregna-3.20-diones
Encapsulation for organic optoelectronic devices
Actinically-induced polyermization
Thermal-dye-transfer label capable of reproducing flesh tones
Methods and systems for computer aided targeting
Total knee prosthesis with resurfacing and posterior stabilization capability
Checkpoint service
Device for and method of carrying out optical measurements in turbid media
Atomic layer deposition of CeO.sub.2/Al.sub.2O.sub.3 films as gate dielectrics
BGA-type multilayer circuit wiring board