Resources Contact Us Home
Solder reflow mounting board

Image Number 3 for United States Patent #5373113.

A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.

  Recently Added Patents
Magnetic detection of small entities
Group control method for machine type communication and mobile communication system using the method
Bacterial superantigen vaccines
Image forming apparatus
System and methods for obstacle mapping and navigation
Delay lines, amplifier systems, transconductance compensating systems and methods of compensating
System, method and computer program product for efficient caching of hierarchical items
  Randomly Featured Patents
Powdered emulsion product and method of production
Recording medium of stream data, and recording method and playback method of the same
Apparatus to mechanically stress a bolt-type fastener
Method and system for providing a small business coupon distribution system
Growth promoters for animals
Discharge tube for a high pressure metal vapor discharge lamp and a method of manufacturing the same
Functionalized glazing
Angle gauge
Generating and supplying user context data
Shoe outsole