Resources Contact Us Home
Solder reflow mounting board

Image Number 2 for United States Patent #5373113.

A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.

  Recently Added Patents
Method and system for providing status of a machine
Metal-containing compositions and method of making same
Vertical gate LDMOS device
Process for improving the hydrolysis of cellulose in high consistency systems using one or more unmixed and mixed hydrolysis reactors
Catecholic butanes and use thereof for cancer therapy
Integrated projector system
Dynamically reconfigurable systolic array accelorators
  Randomly Featured Patents
System and method for providing transparency in delivering private network features
Primer compositions
Transfer sheets for thermal transfer recording
Heat sink assembly retainer device
Portable air purifier housing
Display frame
Pedal device wherein non-operated position of operating portion is adjustable
Solid processing agent replenishing device for use in a photosensitive material processing apparatus
Method for the examination of objects with ultrasound
Polydicyclopentadiene having improved odor