Resources Contact Us Home
Manufacturing method of a semiconductor device

Image Number 3 for United States Patent #5356838.

A method of manufacturing and a structure of a semiconductor device has an I/O terminal whereby when individual semiconductor chips are separated from the semiconductor wafer manufactured according to this invention, the terminals are exposed on the edges of the semiconductor chip allowing for the interconnection of the terminals when the semiconductor chips are stacked. The bump electrode is formed using metal masks and magnets by mounting a solder ball on an aperture of a first mask to form the solder bump on an electrode pad provided on a semiconductor wafer. A conductive material forms a conductive pattern between the solder bumps of the individual semiconductor chips using an aperture of a second mask. The individual semiconductor chips which are separated from the semiconductor wafer are then easily stacked and packaged by use of the I/O terminals on the sides of the individual semiconductor chips.

  Recently Added Patents
Selection of system parameters based on non-acoustic sensor information
Enzymatic demethylation of flavonoids
Highly detectable pilot structure
Multi-touch recognition resistive touch screen for recognizing multi-touch coordinates through capacitor charging time
Fabrication method of packaging substrate having through-holed interposer embedded therein
Humidity indicator and method for fabricating the same
Conductor for transmitting electrical power
  Randomly Featured Patents
Hydraulic seal with pressure-actuated ridges
Food preparation table with open top food containers
Cap structure for zipper
Machine tool, transfer machine tool, and method for the machining of a workpiece
Method and apparatus for concatenating bits of odd-length words
Automated monitoring for clinching joints
Remote access program, remote access request-processing program, and client computer
Flow cut-off method and apparatus for foundry installations
Method and apparatus for making a reclosable package
Apparatus for automatic application of compositions to the skin