Resources Contact Us Home
Contact manufacturing method of a multi-layered metal line structure

Image Number 4 for United States Patent #5354713.

The present invention relates to a manufacturing method of a contact of a multi-layered metal line of a highly integrated semiconductor device.The insulating layer between the metal lines is flattened and step coverage is improved by using a SOG layer or polyimide.

  Recently Added Patents
Means to securely fixate pacing leads and/or sensors in vessels
Optical writer and image forming apparatus including same
Tube lighting fixture
Image forming apparatus forming images in response to image formation request from operation unit or external device
Method for distributing advertisements to client devices using an obscured ad monitoring function
Physiological measuring system comprising a garment in the form of a sleeve or glove and sensing apparatus incorporated in the garment
Methods and systems for aggregating and graphically representing information associated with a telecommunications circuit
  Randomly Featured Patents
Method and system for detecting the end-point in etching processes
Sterilization cassette and method
Videocassette package
Dietary fat control automatic calculator system and fold label fat evaluator
Piezoelectric filter and method for manufacturing the same
Word forming game
Flame resistant, expandable styrene polymers and foams, and flame retardants
Automated sewing device
Fitting piece for attaching and locking a freely-rotating replacement roller
RAID system for performing efficient mirrored posted-write operations