Resources Contact Us Home
Contact manufacturing method of a multi-layered metal line structure

Image Number 4 for United States Patent #5354713.

The present invention relates to a manufacturing method of a contact of a multi-layered metal line of a highly integrated semiconductor device.The insulating layer between the metal lines is flattened and step coverage is improved by using a SOG layer or polyimide.

  Recently Added Patents
Software self-checking systems and methods
Computer systems and methods for the query and visualization of multidimensional databases
Exposure apparatus, exposure method, and device manufacturing method
Mechanism for visible users and groups
Feedback method and processing system for policy installation failures
Semiconductor device, integrated circuit and method of manufacturing an integrated circuit
Method and apparatus for map transmission in wireless communication system
  Randomly Featured Patents
Laser pet toy
Osmotic water purification pumping system with flush valve
Tank actuation panel
Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board
Plate base fixing structure
Medication dispenser
Adaptive control methods and apparatus using frequency analysis of time series data
Apparatus for handling facing sheets for the production of pressed board and other laminates
System and method of radio transmission between a radio transmitter and radio receiver
Steam-sterilizable carbon dioxide sensor