Resources Contact Us Home
Contact manufacturing method of a multi-layered metal line structure

Image Number 4 for United States Patent #5354713.

The present invention relates to a manufacturing method of a contact of a multi-layered metal line of a highly integrated semiconductor device.The insulating layer between the metal lines is flattened and step coverage is improved by using a SOG layer or polyimide.

  Recently Added Patents
Audio and music data transmission medium and transmission protocol
Device, information processing method, and computer-readable storage medium
Cross-linkable compositions
Wireless control kit for camera
Recovery of a hot-pluggable serial communication link
Methods and devices for multiple-mode radio frequency synthesizers
  Randomly Featured Patents
Security device for deadbolt lock
Process for producing agglomerates from dusts
Impact mechanism
Method for selective deposition of a semiconductor material
Ink jet apparatus
Method for reducing message translation and traffic through intermediate applications and systems in an internet application
Method and apparatus for converting and optimizing editing files
Travel game arrangement
Assembly method and installation, a device assembled thereby, and a unit including the device
Modular block system