Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Contact manufacturing method of a multi-layered metal line structure










Image Number 4 for United States Patent #5354713.

The present invention relates to a manufacturing method of a contact of a multi-layered metal line of a highly integrated semiconductor device.The insulating layer between the metal lines is flattened and step coverage is improved by using a SOG layer or polyimide.








 
 
  Recently Added Patents
Negative electrode material for non-aqueous electrolyte secondary battery, method for manufacturing negative electrode material for non-aqueous electrolyte secondary battery, non-aqueous elect
Memory device and semiconductor device
Multi charged particle beam writing apparatus and multi charged particle beam writing method
Focus information generating device and focus information generating method
Automated solar collector installation design including ability to define heterogeneous design preferences
Plants and seeds of hybrid corn variety CH089600
Profiling activity through video surveillance
  Randomly Featured Patents
Magnetic head having a laminated yoke layer with protected pole piece and disk drive containing the same
Method of implanting a transmyocardial stent
Wireless bicycle communication device
Optical sheet with structured surface
Collecting chamber for a vacuum cleaner
Vacuum type portable sander
Oil stove
Method for diagnosis and treatment of psychological and emotional disorders using a microprocessor-based video game
Seat belt cover
Periodontal probe