Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Contact manufacturing method of a multi-layered metal line structure










Image Number 4 for United States Patent #5354713.

The present invention relates to a manufacturing method of a contact of a multi-layered metal line of a highly integrated semiconductor device.The insulating layer between the metal lines is flattened and step coverage is improved by using a SOG layer or polyimide.








 
 
  Recently Added Patents
Fluid conduit with PTC fabric heating
Nanoparticle entrapment of materials
Image processing apparatus, image forming system, and computer-readable storage medium
Satellite communication network
Apparatus and method of preventing signal delay in display device
Method of fabricating solid electrolytic capacitor and solid electrolytic capacitor
Systems and methods for providing a shared folder via television
  Randomly Featured Patents
Method for treating and inhibiting gastric and duodenal ulcers
Yarn monitoring process
Method for the optical detection of objects, whose surfaces can reflect or scatter light and which have self-affine, or self-similar, or fractal patterns or structures
Cover for the valve rocker compartment of internal combustion engines, with a lubricating oil anti-sucking device
Insufflation system, attachment and method
Shotgun disabling device
Metal immunity in a reverse magnetic system
Centrifugal sifter and elements thereof
Method to create an enclosure for an electronic device
Use of conductor compositions in electronic circuits