Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
IC package and LSI package using a lead frame formed of a copper-zirconium alloy










Image Number 2 for United States Patent #5341025.

An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less is disclosed. The lead frame is, for example, obtained from an alloy that contains 0,005% by weight of sulfur or less. The lead frame has high reliability, can be produced in high yield and has high electrical conductivity.








 
 
  Recently Added Patents
Method for cutting C--Mn steel with a fiber laser
System and method for converting biomass to ethanol via syngas
Methods and apparatus for address translation functions
Storage system comprising multiple microprocessors and method for sharing processing in this storage system
Combination photovoltaic and wind power generation installation
Polymeric compositions including their uses and methods of production
Automated difference recognition between speaking sounds and music
  Randomly Featured Patents
Composition for detection of cell density signal molecule
Balanced gerotor device with eccentric drive
Club heads with contoured back faces and methods of manufacturing the same
Accelerated fibre channel hub and protocol
Low voltage cartridge fuse design
Chronograph timepiece and lever device for timepiece
Baby accessory holder kit
Cabinet knob
Multi-axis photometric inspection system and method for flat panel displays
Method for preparing aminoethyl imidazolidinone or the thiocarbonyl thereof