Resources Contact Us Home
Stacked chip assembly and manufacturing method therefor

Image Number 3 for United States Patent #5311401.

Two or more integrated circuit or memory chips (64-66, 104, 106-108, 116-118, 122-126) are stacked on a circuit substrate (72, 100) or a printed-wiring board in such a manner that the planes of the chips lie horizontally, rather than vertically, on the substrate or wiring board. The chips are preferably interconnected along all of their edges (68) and thence, preferably by ribbon bonds, to the substrate or wiring board. The thus assembled arrangement is hermetically sealed by coatings of passivation and encapsulant. Such chips (25) are oversized, as distinguished from chips conventionally diced from wafers. Specifically, each chip is larger than an individual wafer circuit (18, 20), that is, each wafer portion (24) which is selected to be formed into a chip has a size that is larger than the individual wafer circuit which it incorporates, thus overlapping adjacent circuits.

  Recently Added Patents
Method and system for providing cloud based network security services
Portable communication terminal, communication method and control program
Plural component proportioner
Method and apparatus for controlled reoxygenation
Printing device, printing system, program, and printing method for printing based on print data from a user authorized to issue a print instruction for the print data
Non-volatile semiconductor memory and data processing method in non-volatile semiconductor memory
Mobile terminal device capable of more effectively utilizing operation portions, conductive portion, operation detecting unit, power supply unit, and signal processing unit
  Randomly Featured Patents
Capacitor element for a power capacitor, a method for manufacturing the same and a power capacitor comprising such capacitor element
Motor vehicle door or hatch
Spin valve sensor with exchange tabs
Method of manufacturing of printing apparatus
System for converting fuel and air into reformate
Image-capturing device and projection automatic calibration method of projection device
Type of wrapped textile thread and process for its production which involves thermofusion to secure wrapping to core
Developer for developing electrostatic latent image and image forming method
Image forming apparatus to provide multicolor images
Closure with gas-barrier liner and package incorporating same