Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Stacked chip assembly and manufacturing method therefor










Image Number 3 for United States Patent #5311401.

Two or more integrated circuit or memory chips (64-66, 104, 106-108, 116-118, 122-126) are stacked on a circuit substrate (72, 100) or a printed-wiring board in such a manner that the planes of the chips lie horizontally, rather than vertically, on the substrate or wiring board. The chips are preferably interconnected along all of their edges (68) and thence, preferably by ribbon bonds, to the substrate or wiring board. The thus assembled arrangement is hermetically sealed by coatings of passivation and encapsulant. Such chips (25) are oversized, as distinguished from chips conventionally diced from wafers. Specifically, each chip is larger than an individual wafer circuit (18, 20), that is, each wafer portion (24) which is selected to be formed into a chip has a size that is larger than the individual wafer circuit which it incorporates, thus overlapping adjacent circuits.








 
 
  Recently Added Patents
System and method for optimizing teams
Device with a floating head having a heater element
Communication apparatus, integrated circuit, and communication method
Keyswitch controller
Active gate drive circuit
Method of predicting a motion vector for a current block in a current picture
Manipulation of an alternative respiratory pathway in photo-autotrophs
  Randomly Featured Patents
Elastomeric bearing for helicopter rotor having lead-lag damping
Polysilicon thin film transistor and method of fabricating the same
Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect
Neutral centering device for hydrostatic transmission
Planar multi-level metal process with built-in etch stop
2-(Trichloromethyldithio)acetic acid and related compounds
Hub device for preventing liquid leakage
LED flashlight including a housing having a translucent portion
Homokinetic joint of the tripod type
Image forming apparatus for selective copying of segmented areas of an image