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Method of forming a bonded component










Image Number 2 for United States Patent #5284200.

The present invention relates to a method for bonding metal and ceramic parts to form a bonded component. The method of the present invention allows the metal part and the bond to be fabricated concurrently. The strength of the bond can be controlled through choice of the material for the metal part, and by varying the thickness of the bond region. The bond region is formed by mixing ceramic particles with fibers and subsequently removing the fibers forming voids within the ceramic part. The bond region is formed with a second ceramic particle region adjacent to it.








 
 
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