Resources Contact Us Home
Semiconductor device

Image Number 5 for United States Patent #5250760.

A semiconductor device of a multilayer interconnection structure which includes a plurality of insulating layers and a plurality of metal interconnection layers. The uppermost metal interconnection layer is formed in a hall in the uppermost interlayer insulating layer. The uppermost interconnection layer is formed as a bonding pad portion and a part of the layer is formed into a ring-shaped portion so as to cover the side portion of the hall.

  Recently Added Patents
Method and system for generating and displaying an interactive dynamic graph view of multiply connected objects
Apparatus for preventing overcharge of a battery
Metal foil laminate, substrate for mounting LED, and light source device
Linear transformer power supply
Devices including composite thermal capacitors
Storage system, control method therefor, and program
Spatially pre-processed target-to-jammer ratio weighted filter and method thereof
  Randomly Featured Patents
Method and apparatus for cleaning inkjet cartridges
Modification to towed array bulkheads
Protective tubular light with multi-part covers
Cleaning system for a filling machine
Semiconductor memory device having fewer memory cell plates being activated in a test mode than in a normal mode
Adjustable length pool cue
Rollover protection system for vehicles
Controller which generates data suitable for inkjet printhead
Substituted oxime derivatives and processes for their preparation
Faucet spout