Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for interconnecting layers in a semiconductor device using two etching gases










Image Number 2 for United States Patent #5234864.

A method for interconnecting layers in a semiconductor device is disclosed. The device includes a lower conductive layer formed by capping a second conductive layer on a first conductive layer, a contact window formed in an inter-insulating layer on the lower conductive layer, and an upper conductive layer connected to the lower conductive layer through the contact window. The contact window is formed by removing a portion of the inter-insulating layer where the contact will be formed using a first etching gas, and removing a portion of the second conductive layer where the contact will be formed using a second etching gas. The contact resistance becomes uniform by preventing the formation of a non-volatile mixture in the contact window, and the reliability of the device is improved by planarizing the surface of the lower conductive layer.








 
 
  Recently Added Patents
Cell reselection and handover with multimedia broadcast/multicast service
System and method for enhancing buyer and seller interaction during a group-buying sale
Markers of acute myeloid leukemia stem cells
Detection of procedural deficiency across multiple business applications
Magnetic recording medium, information storage device, and method of manufacturing magnetic recording medium
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
Methods of reverse link power control
  Randomly Featured Patents
Stick-on, protective magnet
Wiring pattern inspecting method and system for carrying out the same
Electric switch for protection appliances such as a cut out
Resuscitator
Compound semiconductor epitaxial wafer
Manufacturing semiconductor device including forming a buried gate covered by an insulative film and a channel layer
Adapter for a printed circuit board testing device
Method of making wire harnesses
Springback compensated continuous roll forming machines
Superlattice cladding layers for mid-infrared lasers