Resources Contact Us Home
Method and apparatus for improving planarity of chemical-mechanical planarization operations

Image Number 3 for United States Patent #5232875.

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer to be polished and the moving polishing pad is generated by the force of gravity acting on at least the wafer and the carrier; in another it is provided by a mechanical force applied normal to the wafer surface. The polishing pad is wetted with a slurry having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer.

  Recently Added Patents
Tap and linking module TDO register, gating for TCK and TMS
Image forming apparatus detecting color patterns and generating interleaf images at predetermined position
Radio frequency splitter
Antenna tuning on an impedance trajectory
Memory device, test operation method thereof, and system including the same
Transmission device
Refuelable battery-powered electric vehicle
  Randomly Featured Patents
Liquid crystal display device and driving method of the same
Clasp for detachably securing footwear upper
Knee brace and method for securing the same
Combination kitchen tool
Pipeline arithmetic code decoding method and apparatus using context index predictor
Light-emitting device, electronic device, and lighting device
Method and system for downhole clock synchronization
Metal-air battery with programmed-timing activation
Distributed interconnect
Fluorination process