Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and apparatus for improving planarity of chemical-mechanical planarization operations










Image Number 3 for United States Patent #5232875.

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer to be polished and the moving polishing pad is generated by the force of gravity acting on at least the wafer and the carrier; in another it is provided by a mechanical force applied normal to the wafer surface. The polishing pad is wetted with a slurry having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer.








 
 
  Recently Added Patents
Using prime numbers to manage partitioning in a cluster of nodes of computers
Brick moulding system for window frames and door frames and method of manufacture of same
Mobile terminal and method for correcting a captured image
Intelligent softswitch for managing a call
Exploiting conditions to optimize expensive database queries
Lighting fixture
Heteroaryl-substituted amides comprising an unsaturated or cyclic linker group, and their use as pharmaceuticals
  Randomly Featured Patents
Portion of an upper of a footwear article
Low-mass ophthalmic lens
Surgical retrieval assembly and associated method
Display screen or portion thereof with a graphical user interface
Molded surface of a concrete product
Stopper structure for engine mount
Resonant acoustic projector
High speed glide target
Product display and display hook for use in same
Light emitting diode indicator