Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and apparatus for improving planarity of chemical-mechanical planarization operations










Image Number 3 for United States Patent #5232875.

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer to be polished and the moving polishing pad is generated by the force of gravity acting on at least the wafer and the carrier; in another it is provided by a mechanical force applied normal to the wafer surface. The polishing pad is wetted with a slurry having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer.








 
 
  Recently Added Patents
Bacterial superantigen vaccines
Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
Systems and methods for velocity profile based approach to point control
Identification of websites that break out of frames
Field emission cathode structure
Mobile computing terminal
System and method of verification of analog circuits
  Randomly Featured Patents
Line of sight target adaptor
Methods of tomographically inverting picked events on migrated seismic data
Automatic adapt circuit for circumventing demodulator transients in radio receiver
Wabocrete FMV
Glazed roofs
Long-reach ethernet for 1000BASE-T and 10GBASE-T
Methods for isolating and characterizing endogenous mRNA-protein (mRNP) complexes
Apparatus for supporting a fabric over an aperture
Compositions and methods for improving heart function
Liquid crystal display for a modem enclosure