Resources Contact Us Home
Method and apparatus for improving planarity of chemical-mechanical planarization operations

Image Number 3 for United States Patent #5232875.

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer to be polished and the moving polishing pad is generated by the force of gravity acting on at least the wafer and the carrier; in another it is provided by a mechanical force applied normal to the wafer surface. The polishing pad is wetted with a slurry having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer.

  Recently Added Patents
Process for the production of an acylation catalyst
Measuring apparatus for measuring a physical property of a sample
Lighting control device and lighting control method
Semiconductor device
System for presenting media services
Sampling filter device
Fuel cell with air channel actuator
  Randomly Featured Patents
Heterogeneous polymer blend with continuous elastomeric phase and process of making the same
Method of determination of corrosion rate
Digital demodulator for differentially encoded phase-shift-keyed data
Method and system for predictive control for live streaming video/audio media
Water survival kit
Rapid restart system for cryogenic air separation plant
Knock detection apparatus
Windshield wiper arrangement
Method and system for verifying network credentials
Multi-purpose message board