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Diffusion barrier for copper features

Image Number 2 for United States Patent #5164332.

A diffusion barrier which reduces the diffusion of a copper feature into an oxygen containing polymer is provided by a copper metal alloy. The diffusion barrier is fabricated by coating a metal on a copper feature, heating the metal and copper feature to form an alloy of the copper feature and the metal, etching the non-alloyed metal which covers the alloy, and depositing an oxygen containing polymer on the alloy. Preferably the metal is aluminum and a copper aluminum alloy diffusion barrier is at least 300 angstroms thick and contains at least 8 percent aluminum on the surface in contact with the polymer.

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