Resources Contact Us Home
Lead frame having at least two islands and resin molded semiconductor device using it

Image Number 6 for United States Patent #5126823.

A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.

  Recently Added Patents
Estimation of the impulse response of a system on the basis of binary observations
Beta-amyloid PET imaging agents
Control of a defibrillator and/or pacemaker
Process for removing hydrazine from hydroxlyamine solutions
Chemical-selective device
Scanned laser vein contrast enhancer
Method of forming supported doped palladium containing oxidation catalysts
  Randomly Featured Patents
Gas monitoring system and sidestream gas measurement system adapted to communicate with a mainstream gas measurement system
Head substrate, printhead, head cartridge, and printing apparatus
Non-volatile memory array
Smart antenna connect mechanism to achieve signal integrity without affecting voltage standing wave ratio
Balance and a method for operating a balance
Method, network system and center for intermediating transactions
Slow-release insect-repellent fabric composition and related methods
Music instrument tuner
Integrated circuit fabrication method utilizing selective etching and oxidation to form isolation regions
Classifier and controller for vertical mill