Resources Contact Us Home
Lead frame having at least two islands and resin molded semiconductor device using it

Image Number 6 for United States Patent #5126823.

A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.

  Recently Added Patents
Oxide material, electrophotographic photoreceptor, process cartridge, and image forming device
Generating agricultural information products using remote sensing
Personalized health communication system
Signal processor and signal processing method
System and method for optimizing use of plug-in air conditioners and portable heaters
High performance design rule checking technique
Electric washing machine
  Randomly Featured Patents
Separating liquids
Tool holder having insert seat with flexible side surface
Electrostatic inkjet head having an accurate gap between an electrode and a diaphragm and manufacturing method thereof
Folding baby stroller system and method
Metallic anodes manufactured from molten copper
Method for electromagnetically shielding inductive voltage detectors
Preservation of liquid biological samples
Methods for coating an implantable device
Synchronization circuit, synchronization method, and reception system
Cast molding die and process for producing information recording medium using the same