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Lead frame having at least two islands and resin molded semiconductor device using it










Image Number 6 for United States Patent #5126823.

A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.








 
 
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