Resources Contact Us Home
Apparatus for mounting a flat package type IC

Image Number 6 for United States Patent #5068588.

An apparatus for mounting a flat package type IC on a printed circuit board is disclosed. The apparatus includes: a robot hand for holding the IC; cameras each for taking an image of a part of the IC taking an image of a part of the board, which cameras are fixed to the hand and arranged symmetrically with respect to the rotation axis of the hand; a first processor for obtaining linear deviation and rotational deviation of leads from the images of the IC, and for obtaining linear deviations and rotational deviation of lands from the images of the board; a second processor for obtaining a linear difference between the linear deviations of the IC and board, and for obtaining a rotational difference between the rotational deviations of the IC and board; and a driver for adjusting the position of the IC, by linearly moving the hand by the linear difference, and by rotating the hand by the rotational difference, thereby correctly positioning the leads on the corresponding lands.

  Recently Added Patents
SRB enhancement on HS-DSCH during cell change
System and method for managing content on a network interface
EpCAM as a reprogramming factor for non-pluripotent cells
Digital display devices and digital projectors with expanded color gamut
System and method for routing streaming data requests
System and method for a TCP mapper
  Randomly Featured Patents
Industrial pallet loading process
Aqueous surfactant compositions with a low pour point
Method and system for implementing FI function in KASUMI algorithm for accelerating cryptography in GSM/GPRS/EDGE compliant handsets
Direct hydrogen peroxide fuel cell
Temperature sensitive hydraulic fan coupling
Silencing of TGF.beta. type II receptor expression by siRNA
Display refresh memory with variable line start addressing
Zirconium nitride coated article and method for making same
Pet toy