Resources Contact Us Home
Apparatus for mounting a flat package type IC

Image Number 6 for United States Patent #5068588.

An apparatus for mounting a flat package type IC on a printed circuit board is disclosed. The apparatus includes: a robot hand for holding the IC; cameras each for taking an image of a part of the IC taking an image of a part of the board, which cameras are fixed to the hand and arranged symmetrically with respect to the rotation axis of the hand; a first processor for obtaining linear deviation and rotational deviation of leads from the images of the IC, and for obtaining linear deviations and rotational deviation of lands from the images of the board; a second processor for obtaining a linear difference between the linear deviations of the IC and board, and for obtaining a rotational difference between the rotational deviations of the IC and board; and a driver for adjusting the position of the IC, by linearly moving the hand by the linear difference, and by rotating the hand by the rotational difference, thereby correctly positioning the leads on the corresponding lands.

  Recently Added Patents
Signal activated molecular delivery
Method of making a low-Rdson vertical power MOSFET device
Methods and compositions for inhibiting progression to chronic cardiac failure
Translation system adapted for query translation via a reranking framework
Extension of physical downlink control channel coverage
LED string with a capability to maintain a current path and LED unit thereof
  Randomly Featured Patents
Distributed cryptographic management for computer systems
Tissue container
Multi-fiber multi-cylinder position method and apparatus using time-of-flight technique
Brush holder mountable in recess of peripheral wall of electric machine
Pressure sensor and method for manufacturing the pressure sensor
Composite overfilled arch system
Auxiliary vessel lifting, launching, and carrying system
Solid state thermosensitive polymer compositions
Map updating system
Stabilizer system