Resources Contact Us Home
Apparatus for mounting a flat package type IC

Image Number 6 for United States Patent #5068588.

An apparatus for mounting a flat package type IC on a printed circuit board is disclosed. The apparatus includes: a robot hand for holding the IC; cameras each for taking an image of a part of the IC taking an image of a part of the board, which cameras are fixed to the hand and arranged symmetrically with respect to the rotation axis of the hand; a first processor for obtaining linear deviation and rotational deviation of leads from the images of the IC, and for obtaining linear deviations and rotational deviation of lands from the images of the board; a second processor for obtaining a linear difference between the linear deviations of the IC and board, and for obtaining a rotational difference between the rotational deviations of the IC and board; and a driver for adjusting the position of the IC, by linearly moving the hand by the linear difference, and by rotating the hand by the rotational difference, thereby correctly positioning the leads on the corresponding lands.

  Recently Added Patents
Nonvolatile semiconductor memory device
Output circuit
Efficient forward ranking in a search engine
Apparatus and method for exerting force on a subject tissue
Light receiving element with offset absorbing layer
System and method for managing a loyalty program via an association network infrastructure
Device and method for generating soft tissue contrast images
  Randomly Featured Patents
Refresh and select-all actions in graphical user interface
Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same
Data reduction circuit
Mixing prevention circuit for preventing mixing of semiconductor chips and semiconductor chip discrimination method
Air conditioner and method for controlling air conditioner
Detection of apnea and obstruction of the airway in the respiratory system
Method and system for managing commodity transactions
Integrated semiconductor circuit having a multilayer wiring
Blends of polypropylene and elastic alpha-olefin/cyclic olefin copolymers