Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Multi-layer semiconductor device










Image Number 11 for United States Patent #5051865.

A multi-layer semiconductor device which includes a stacked wafer body having a plurality of sets of two semiconductor wafers and a heat sink plate interposed therebetween. An end of the heat sink plate of each set of wafers is exposed at at least one of the side surfaces of the stacked wafer body.An intermediate connecting circuit is provided for connecting circuits in each of the sets of two semiconductors wafers, the intermediate connecting circuit is provided on at least one side surface other than the surface at which the ends of the heat sink plate are exposed.








 
 
  Recently Added Patents
Contactless electrical connector for an induction sensor, and sensor including such a connector
Dual use photovoltaic system
Stackable clothes drying apparatus
Manufacturing aircraft parts
Method for producing carrier on which microorganisms capable of conducting multiple parallel mineralization are immobilized, column reactor and solid medium for cultivating plants
Methods and systems for managing electronic messages
Self assembly of elements for displays
  Randomly Featured Patents
Metalwood with raised sole
Image forming apparatus, program adding method, and a recording medium
Process for preparing 5,6-dihydro-2-methyl-1,4-oxathiin derivatives
DNA encoding the pseudomonas fluorescens sensor/kinase element, lemA, and its use in activating gene expression
Implantable nerve stimulator electrode
Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices
Decoding instructions for trace cache resume state in system passing decoded operations to both trace cache and execution allocation module
Enclosure for compact design backflow prevention device
Piston
Swash plate type servo device for a plunger hydraulic unit