Resources Contact Us Home
Method for making integrated circuits

Image Number 7 for United States Patent #5015600.

In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

  Recently Added Patents
Method and system for providing intelligent call rejection and call rollover in a data network
Dyes and methods of marking biological material
Techniques for image segment accumulation in document rendering
Hepatitis C virus inhibitors
Adding value to a rendered document
Method and system for acquiring support capability of mobile terminal by base station side system
Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method
  Randomly Featured Patents
Leakproof container
Nail clipper
Device for observation inside a body providing improved quality of observation
Frame construction for a compact press section
Tire cleaning system with tire spreader
Quantum communication system
Determining method of thermal processing condition
Methods for use of TSLP and agonists and antagonists thereof
Apparatus for printing on or otherwise decorating hollow bodies
Direct positive color photographic material