Resources Contact Us Home
Method for making integrated circuits

Image Number 7 for United States Patent #5015600.

In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

  Recently Added Patents
Determining phase-specific parameters of a physiological variable
Secure access to customer log data in a multi-tenant environment
Agent for expelling parasites in humans, animals or birds
Active gate drive circuit
Context data in UPNP service information
Markers of acute myeloid leukemia stem cells
Image forming apparatus and job request control method instructed by authenticated users
  Randomly Featured Patents
Pyrimidine derivatives
Presealed integral hematocrit test assembly and method
Medicated nasal dilator
Adjustable support frame for a display screen
Process for producing 3-methylthiopropanal
Sand fighter with folding frame
Method of making a molded interconnect device
Hybrid regulator with switching and linear sections
Portable magnetic device having a ceramic body and a hanger for purifying potable water
Use of prohibitin RNA in treatment of cancer