Resources Contact Us Home
Method for making integrated circuits

Image Number 7 for United States Patent #5015600.

In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

  Recently Added Patents
Mask and method for forming the mask
Method and system for reduction of decoding complexity in a communication system
Integrated advance copper fuse combined with ESD/over-voltage/reverse polarity protection
Architectural panel with Tarwe and grass
Gathering user feedback in web applications
Motor control system, motor control device, and brushless motor
Shot scent dispenser
  Randomly Featured Patents
Apparatus and method for contacting of test objects
Treating blood or blood product with a compound having a mustard and a nucleic acid binding moiety
Fly tying vises
Combined check rail lock and keeper
Actuators based on ferromagnetic shape memory alloy composites
Tilt switch and holder
Laser driver circuit and system
Semiconductor storage device
Laminate film
Polyglutaraldehyde synthesis and protein bonding substrates