Resources Contact Us Home
Method for making integrated circuits

Image Number 7 for United States Patent #5015600.

In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

  Recently Added Patents
Network traffic demotion
Wireless communication system using pilot allocation, method and pilot pattern thereof
Automated tuning in a virtual machine computing environment
Electrode structure and its manufacturing method, and semiconductor module
High performance data transport system and method
Method of transmitting and receiving wireless resource information
Method and apparatus for prioritizing data transfer
  Randomly Featured Patents
Phase locked loop, voltage controlled oscillator, and phase-frequency detector
Compressor with an isolated vane slot
Eight man rowing shell
Vehicle exterior rearview mirror system with a highly viewable display indicator for the driver
Automated acquisition and notification system
Distributed generation system
Electronic musical instruments
Polypeptide of human-origin hyaluronate synthetase and DNA encoding the same
Formed, polymeric organosiloxane ammonium compounds, method of their preparation and use
Device provided with means for maintenance against a communication surface of a contactless data medium