Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reducing hillocking in aluminum layers formed on substrates










Image Number 3 for United States Patent #4992152.

A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.








 
 
  Recently Added Patents
Integrated disk driving module including a stepping motor integrally formed with a base unit
Multi-bank queuing architecture for higher bandwidth on-chip memory buffer
Paging of a user equipment (UE) within a wireless communications system
Attribute category enhanced search
Positive electrode active material for nonaqueous electrolyte secondary battery
Thin film switch and press key/keyboard using the same
Clock face
  Randomly Featured Patents
Lightweight trench box
Speech detector circuit for a TASI system
Tray for visual inspection of semiconductor wafer
Method for controlling a test for an ATM exchange
Jig and method for isostatically pressing ceramic powder
Image processing apparatus and method
Radiographic image enhancement
Folding knife
Rotation angle detecting device
Fire suppression system design tool