Resources Contact Us Home
Reducing hillocking in aluminum layers formed on substrates

Image Number 3 for United States Patent #4992152.

A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.

  Recently Added Patents
Mobile device case with storage compartment
Microporous membranes and methods for producing and using such membranes
Vibration disturbance estimation and control
Parallel active optical cable
Motion blur reduction for LCD video/graphics processors
Look up table (LUT) structure supporting exclusive OR (XOR) circuitry configured to allow for generation of a result using quaternary adders
Display unit and display method
  Randomly Featured Patents
Window skin panel and method of making same
System and method for executing tests on an integrated circuit design
Outside ambient temperature initialization technique
Zero reference generating method and apparatus for optical encoders
Submerged-surface cleaning apparatus with angled filtration system
Nucleic acid molecules encoding phytase and pH2.5 acid phosphatase
Contention revolution in a digital computer system
Battery pack
Folding framing square and layout tool
Emulsion polymerization with large particle size