Resources Contact Us Home
Reducing hillocking in aluminum layers formed on substrates

Image Number 3 for United States Patent #4992152.

A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.

  Recently Added Patents
Testing apparatus and testing method for telephone apparatus
Controlling a video window position relative to a video camera position
Server system and method for discovering digital assets in enterprise information systems
Color image forming apparatus with contact control of process units
Antenna for an automobile
Grid computing accounting and statistics management system
  Randomly Featured Patents
Oxime ethers
Dental material placement and applicator device
Binder coated foundry sand grains
Flow imaging by means of nuclear magnetic resonance
Collecting activity and sleep quality information via a medical device
Personal digital content system
Two-dimensional aperture array for vapor deposition
Slave device complying with bluetooth communication protocol and related method for establishing bluetooth communication connection
Safe use fully disposable electrolysis needle assembly
Adsorption power for removing mercury from high temperature high moisture gas streams