Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Reducing hillocking in aluminum layers formed on substrates Image Number 3 for United States Patent #4992152. A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.       Recently Added Patents Integrated circuit with configurable on-die termination Methods of building crystalline silicon solar cells for use in combinatorial screening Display apparatus that controls a length of an emission period or luminance of a display area according to temperature of a liquid crystal panel Selectable-Tap Equalizer Systems, devices, and methods including multi-harmonic optical detection of hemozoin nanoparticles Software copy protection via protected execution of applications System and method for providing access to an information handling system   Randomly Featured Patents Estrogenic 17.alpha.-halogen-vinylestranes Capillary designs and process for fine pitch ball bonding Integrated resonator and dipole for radiation of high power RF energy Convertible bed Autoclaves Medicines for the prevention and treatment of neurodegenerative diseases System for providing a communication interface Multiple species sputtering method Public communication system comprising distributed stations, and station and sub-station for use in such a communication system Heat recuperator for fireplace © 2006-2008 PatentGenius. All Rights Reserved.