Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reducing hillocking in aluminum layers formed on substrates










Image Number 3 for United States Patent #4992152.

A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.








 
 
  Recently Added Patents
Faucet handle
Nitride semiconductor laser device
Biphotonic photosensitizers, nanoparticles containing the same and their use as drugs
Pyrazole kinase modulators and methods of use
Entropy encoding and decoding using direct level and run-length/level context-adaptive arithmetic coding/decoding modes
Peer-to-peer method of deploying and managing executable code and associated plug-ins
Targeting agents for enhancing radiation therapy
  Randomly Featured Patents
Image forming apparatus and recording medium
Oscillatory mold equipped with a hollow mold cavity which is curved in the direction of travel of the strand
In-kernel content-aware service differentiation
Variably assemblable figurative tile set for covering surfaces
System and method for automatic train operation
Embossing foil and a method of making
Circuit and method for accessing memory cells of a memory device
VCA Decoding scheme for multiple VTR configuration of an audio for video mixer
Recliner adjuster for a seat
System and method for accessing and storing interleaved data