Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reducing hillocking in aluminum layers formed on substrates










Image Number 3 for United States Patent #4992152.

A method of reducing hillocks in an aluminum layer sputtered onto a substrate includes depositing a layer of WSi.sub.2 on the aluminum layer having a thickness of between 1500-2500 .ANG. and then sintering these bilayers.








 
 
  Recently Added Patents
Phase locking loop
Electrical connector
Playlist search device, playlist search method and program
Cis-alkoxy-substituted spirocyclic 1-H-pyrrolidine-2,4-dione derivatives
Electronic component and reflected-wave cancelling method
Selecting one of a plurality of print modes based on pixel coverage of a document
Pattern transfer apparatus and method for fabricating semiconductor device
  Randomly Featured Patents
Managing method, managing system, composite apparatus, ordering apparatus, computer program and memory product
Poultry preparation process and apparatus
Quantitative method of determining beryllium or a compound thereof in a sample
Absorbent foams made from high internal phase emulsions useful for acquiring aquerous fluids
Rotary vane mechanical power system utilizing positive displacement
System for distributing customized commercials to television viewers
Variable stretch detackification adhesive tape unitizer system
Telescoping boat trailer with screw drive and cam detachable safety brake separator
Acoustic output processing apparatus
Model railroad train control system