Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Arrangement for production of explosively formed projectiles










Image Number 4 for United States Patent #4982667.

An arrangement for production of explosively formed projectiles consists of casing with explosive contents, a fuse arranged on the base side and a metal insert which covers the explosive contents on the head side, in which case the projectile acquires wing-like symmetrical folds on its tail by means of the following. The insert and/or the explosive contents and/or the fuse in their outside area and/or the casing on its jacket features at least three inhomogeneities arranged at a distance from the axis of the casing in a symmetrical manner around the circumference such that in the circumferential area of the insert varied. Acceleration is achieved according to the configuration of the inhomogeneities or the impact time of the shock wave or its impact energy is different.








 
 
  Recently Added Patents
Determining phase-specific parameters of a physiological variable
Power converter for an LED assembly and lighting application
Digital broadcast receiver and method for processing caption thereof
Method for resource allocation in a wireless communication network, method for error-free transmission of information, node and wireless communication network
Burner grate
Real-time application of filters based on image attributes
Output circuit
  Randomly Featured Patents
Catadioptric optical system and adjusting method
Image forming apparatus with secondary transfer section having rubber backup roller
Method of reworking an electrical multilayer interconnect
Method of melting vitreous materials and use of the suitable device for the accomplishment of the method
Thin film Schottky barrier device
Method for producing metallic lead by direct lead-smelting
Gel-based therapy member and method
Electronic component module and method of manufacturing the electronic component module
Funnel assembly for vehicles
Polysilicon semiconductor thin film substrate, method for producing the same, semiconductor device, and electronic device