Resources Contact Us Home
Method and apparatus for applying a protective tape on a wafer and cutting it out to shape

Image Number 2 for United States Patent #4925515.

A method for applying a protective tape on a wafer and cutting it out to the shape of the wafer in the process of manufacture of integrated circuits and the like, and an apparatus for use in carrying out the method. The method enables the protective tape to be applied on the wafer without allowing intersurface inclusion of air bubbles and to be accurately cut along the perimeter of the wafer. Any dimensional change with respect to the wafer can be properly coped with.The protective tape, as drawn out from a winder shaft, is applied by means of an application roller on the wafer which is supported and fixed in position on a transfer table.The tape is cut along an orientation flat of the wafer by a subcutter which is in movement integrally with the application roller. A main cutter positioned above the wafer is then lowered and caused to swivel, whereby the protective tape is cut along a circumferential edge of the wafer so that the tape on the wafer is cut out to the contour of the wafer. Any remaining portion of the tape after the cut-out is made is wound onto a take-up shaft.

  Recently Added Patents
Image rotation from local motion estimates
Signal to noise ratio in digital pathology image analysis
Contention based medium reservation for multicast transmission in wireless local area networks
Enforcing alignment of approved changes and deployed changes in the software change life-cycle
Electrical connector
Drink cooler
  Randomly Featured Patents
Fish hook shaped bottle opener
Phenol extended polyurethanes prepared by RIM process
Circuit for generating two distinctive tone bursts with exponentially decaying envelopes
Flat knitting machine with spool shelf
Silicon germanium heterostructure barrier varactor
Method for compensating for environmental parameters on the imaging characteristics of an optical system
Feedback arrangement in a deflection circuit
Quantization apparatus and method, and inkjet printing apparatus using the same
Method and system for remotely browsing objects
Grip coupling