Resources Contact Us Home
Method and apparatus for applying a protective tape on a wafer and cutting it out to shape

Image Number 2 for United States Patent #4925515.

A method for applying a protective tape on a wafer and cutting it out to the shape of the wafer in the process of manufacture of integrated circuits and the like, and an apparatus for use in carrying out the method. The method enables the protective tape to be applied on the wafer without allowing intersurface inclusion of air bubbles and to be accurately cut along the perimeter of the wafer. Any dimensional change with respect to the wafer can be properly coped with.The protective tape, as drawn out from a winder shaft, is applied by means of an application roller on the wafer which is supported and fixed in position on a transfer table.The tape is cut along an orientation flat of the wafer by a subcutter which is in movement integrally with the application roller. A main cutter positioned above the wafer is then lowered and caused to swivel, whereby the protective tape is cut along a circumferential edge of the wafer so that the tape on the wafer is cut out to the contour of the wafer. Any remaining portion of the tape after the cut-out is made is wound onto a take-up shaft.

  Recently Added Patents
Transaction cost recovery queue management
Method and apparatus for establishing a media clip
Matching engine for comparing data feeds with user profile criteria
Carbonyl-ene functionalized polyolefins
Method for increasing expression of active tumor necrosis factor receptor family member-Ig fusion proteins
System and method for managing investment funds
Titanium compounds and complexes as additives in lubricants
  Randomly Featured Patents
Staple and anviless stapling apparatus therefor
Ultrafine emulsion containing a haloalkynyl derivative
Photochromic compounds and compositions
Electromechanical three-trace junction devices
Imaging lens
Method for circulating solid material in a fluidized bed reactor
Wavelength normalization of fiber-optic loss measurements
Process for treating gas or liquids that are obtained from catalytic reforming
Single phase to polyphase bridge-type frequency multiplier
Polymeric antioxidants