Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Bearing ring for supporting items on solid or hollow cylindrical parts










Image Number 3 for United States Patent #4732492.

The cylinder may be an aircraft landing gear axle. The items may be pick-ups the sense axle deformation. A ring (30) for supporting the pick-ups is made of highly resilient material. It is initially of such a size that its cylinder-engaging surface overlaps the cylindrical surface it is to engage. The ring is then deformed by urging at least two points (34 to 37) around its circumference to increase the degree of overlap. While maintaining the deforming force on the ring, its cylinder-engaging surface (31) is machined so that there is no longer any overlap, and still maintaining the force, the ring is engaged with the cylinder. The force is then removed. The said points move resiliently away from the cylinder, but intermediate points are consequently resiliently urged into contact with the cylinder. The contact is smooth and progressive, thus avoiding the kind of stress concentrations that could reduce cylinder life by fatigue, etc.








 
 
  Recently Added Patents
Laboratory type quick film drying oven
Method and apparatus for measuring oxidation-reduction potential
Disaster relief kit
Solid electrolytic capacitor and manufacturing method thereof
Non-stick coating having improved abrasion resistance, hardness and corrosion on a substrate
Fuel-pressure waveform detector
Method for scroll bar control on a touchpad and touchpad with scroll bar control function
  Randomly Featured Patents
Toy sheep figure
Verification of computer program versions based on a selected recipe from a recipe table
Vehicle track
Container for perfumes and cosmetic products
Wire connection structure of electric rotating machinery
Customer care support system with call avoidance processing
Vacuum cleaner
Appliance suitable for self-diagnosis for measuring the bodily states of a human being
Switching circuit and semiconductor device
Bump structure, bump forming method and package connecting body