Resources Contact Us Home
Method for producing connecting elements for electrically joining microelectronic components

Image Number 6 for United States Patent #4703559.

Method for producing a plurality of deformable connecting elements for electrically joining microelectronic components. The method includes irradiating with high energy radiation portions of a plate-like member composed of material having a material characteristic which is changed by such high energy radiation, each portion having dimensions corresponding to those of a connecting element; utilizing the changed material characteristic of the material of the irradiated portions to remove such material from the irradiated portions to produce a plate-like mold containing a plurality of mold structures each defining a shape corresponding to a connecting element at a given location of said member, each such mold structure having lateral dimensions and a height dimension which is a multiple of the smallest lateral dimension; filling the mold structures with metal by electroplating the metal into such mold structures to produce metallic connecting elements; fixing the connecting elements to a microelectronic component; and removing the plate-like mold.

  Recently Added Patents
Carrier or transport strip
System and method for backup communication over ethernet
Lens module and method for manufacturing thereof
Battery cell separator
Bulk vending apparatus, system and method
Apparatus and method for performing lawful intercept in group calls
Formation of an optical waveguide
  Randomly Featured Patents
System for supplying a program from a server to a printing device through a network based on operating environment characteristics of installed optional units
Method for loading an operating system through a network
Food compositions for pigs and processes for the feeding of pigs
One-piece glass prefilled syringe system
Information processing system
Configurable integrated circuit with error correcting circuitry
Maize variety hybrid X03B491
Hybrid strained orientated substrates and devices
Ni-based sintered alloy
Radiation emitting component