Image Number 3 for United States Patent #4652848.
A fusible link for an electrical circuit consists of a length of fusible material which closely fits an aperture through a ceramic printed circuit board. Ends of the fusible element electrically contact respective electrical leads on opposed surfaces of the board. A resistive film forming part of the electrical circuit is located close to the fusible link site so that when overvoltage conditions exist the resistive film heats the circuit board until eventually the fusible material melts, flows out of the aperture and the electrical circuit is broken. The fusible link is soldered and/or swaged into position and projects beyond the surface of the circuit board so that when the solder melts, surface tension forces tend to pull the solder out of the aperture.