Resources Contact Us Home
Lead frame structure

Image Number 5 for United States Patent #4556896.

A novel lead frame structure is provided which contains an integral arrangement of leads for connection to a semiconductor device and a molded housing is then molded around the semiconductor device and the lead frame. The lead elements of the frame are then separated to define a plurality of individual semiconductor devices. The lead frame has an enlarged finger section which receives a semiconductor die. The enlarged lead frame finger has an opening just behind the region which receives the die. This opening as well as all identical openings along the length of the lead strip are then aligned with respective molding gates in one half of a pair of cooperating molding dies so that plastic injected through the gate flows through the opening and upwardly into the mold with the plastic filling the mold cavity from top to bottom while ejecting air from the mold as the mold fills through the clearance opening between the ejector pin and its receiving opening.

  Recently Added Patents
Voltage detection apparatus and combination circuit
Inhibitors of bacterial nitric oxide synthase, and related screening methods
Expandable mobile device
Adaptive flow for thermal cooling of devices
Process for preparing red cocoa ingredients, red chocolate, and food products
System and method for reducing the risks involved in trading multiple spread trading strategies
Method for incubating the contents of a receptacle
  Randomly Featured Patents
Knock down litter board
Process for testing for substances in liquids
Adaptive testing of system acquisition and roaming characteristics for CDMA wireless communication systems
Combustion chamber and gas turbine installation
Rechargeable battery packs and related methods
Monitoring and control system with binary addressing
3'-exonuclease, production and use thereof
Storage device
Display device
Sanitant arrangement