Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy










Image Number 4 for United States Patent #4500383.

A process for bonding a copper or copper-chromium alloy body and a ceramic body of components of an electrical or electronic device to each other includes a step of directly sandwiching a layer of chromium oxide between the ceramic and copper or copper-chromium bodies, a step of heating a temporary assembly of the ceramic and copper or copper-chromium alloy bodies and the layer of chromium oxide, under an atmosphere which can oxidize chromium without oxidizing copper, at a temperature of at least 900.degree. C. but below the melting point of copper or the alloy, and then a step of slowly cooling the resulting bonded assembly. In particular, in a process for bonding the alloy body to the ceramic body, the chromium oxide sandwiching step is performed concurrently with the temporary assembly heating step. The bonding process can produce a hermetic envelope, particularly a vacuum envelope of a vacuum interrupter. The process for bonding the copper or alloy body to the ceramic body of this invention is more advantageous than bonding processes employing the so-called Telefunken method, in terms of cost and steps.








 
 
  Recently Added Patents
Synthesis of 8-amino boron dipyrromethenes having blue fluorescence
Strongly bound carbon nanotube arrays directly grown on substrates and methods for production thereof
Solid-state imaging device and imaging apparatus
Accessing device via communication protocol selection
Sterilizable film for aseptic packaging
Actuators and moveable elements with position sensing
Fabrication of high gradient insulators by stack compression
  Randomly Featured Patents
Trickle charge circuit for an off-line switching power supply
Process and apparatus for turning head to foot and packing dissymmetrical oblong bodies
Switching amplifier
Release layer paste and method of production of a multilayer type electronic device
Input/output control apparatus, input/output control method and information storage system
Modifier for vacuum booster reaction force
Human antibodies specific for interleukin 15 (IL-15)
Walking sole and carrier assembly for rigid-bottomed footgear
Two-stage vehicle spring suspension
Gear lever clutching structure for prevention of gear slip